Chip Beads (2508055007Y0)

Part Number: 2508055007Y0

MULTI-LAYER CHIP BEAD

 

 

 

 

 

Fair-Rite offers a broad selection of cost effective multi-layer chip beads to suppress conducted EMI signals. Chip beads can be used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.

Chip Beads are available in standard, high and GHz signal speeds.

Recommended Soldering Profile

Packaging Options:
-All multi-layer chip beads are supplied taped and reeled, if required bulk packed chip beads can be provided.

The suggested land patterns are in accordance to the latest revision of IPC-7351.

Weight: 0.01 (g)

Package Size: 0805 (2012)

Dimmmmm tolnominal inchinch misc.
A0.9±0.200.035_
B1.25±0.200.049_
C2±0.200.079_
D0.5±0.300.02_
Land Patterns
VWXYZ
0.60
(0.024”)
1.90
(0.075”)
1.50
(0.059”)
1.30
(0.051”)
_
Reel Information
Tape Width mmPitch mmParts 7" ReelParts 13" ReelParts 14" Reel
84400010000_

Chart Legend
+ Test frequency

Typical Impedance (Ω)
50 MHz36
100 MHz+50 ±25%
500 MHz73
1000 MHz+-
Electrical Properties
Max DCR
(Ω)
0.15
Max Current
(mA)
300

The impedance values listed are typical values. The nominal impedance with a +/- 25% tolerance is specified for the + marked 100 MHz. Chip beads are measured for impedance on the HP 4291A and fixture HP 16192A.
Chip beads are 100% tested for impedance and dc resistance.

Typical Impendance (Ω)
50 MHz36
100 MHz+50 ±25%
500 MHz73
1000 MHz+

Fair-Rite Products Corp.     One Commercial Row, Wallkill, New York 12589-0288
888-324-7748      845-895-2055      Fax: 845-895-2629      ferrites@fair-rite.com      www.fair-rite.com